TCL科技(000100)2020-11-06融资融券信息显示,TCL科技融资余额3,585,976,106元,融券余额107,749,510元,融资买入额332,105,341元,融资偿还额359,106,097元,融资净买额-27,000,756元,融券余量16,178,605股,融券卖出量964,100股,融券偿还量1,328,300股,融资融券余额3,693,725,616元。TCL科技融资融券详细信息如下表:
交易日期 | 代码 | 简称 | 融资融券余额(元) |
---|---|---|---|
2020-11-06 | 000100 | TCL科技 | 3,693,725,616 |
融资余额(元) | 融资买入额(元) | 融资偿还额(元) | 融资净买额(元) |
3,585,976,106 | 332,105,341 | 359,106,097 | -27,000,756 |
融券余额(元) | 融券余量(股) | 融券卖出量(股) | 融券偿还量(股) |
107,749,510 | 16,178,605 | 964,100 | 1,328,300 |